Tear and interconnect domain decomposition analysis of piecewise penetrable structures

Literals

ou:vecesCitado
- 0
bibo:doi
- 10.1109/iceaa.2019.8879200
dcterms:contributor
- Martin, V.F., Taboada, J.M., Solis, D.M., Larios, D., Obelleiro, F.
ou:bibtex
- @article{Soĺis2019,title = {Tear and interconnect domain decomposition analysis of piecewise penetrable structures},journal = {Proceedings of the 2019 21st International Conference on Electromagnetics in Advanced Applications, ICEAA 2019},year = {2019},pages = {1132},author = {Martin, V.F. and Taboada, J.M. and Solis, D.M. and Larios, D. and Obelleiro, F.}}
dcterms:creator
- Martin V.F.
dcterms:publisher
- Proceedings of the 2019 21st International Conference on Electromagnetics in Advanced Applications, ICEAA 2019
vivo:identifier
- 2019-1289
fabio:hasPublicationYear
- 2019
ou:eid
- 2-s2.0-85074910391
bibo:isbn
- 9781728105635
bibo:page_range
- 1132
ou:tipoPublicacion
- Conference Paper
dcterms:title
- Tear and interconnect domain decomposition analysis of piecewise penetrable structures
vcard:url
- https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85074910391&origin=inward
ou:urlOrcid
- http://www.scopus.com/inward/record.url?eid=2-s2.0-85074910391&partnerID=MN8TOARS
ou:urlScopus
- https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85074910391&origin=inward