Tear-and-Interconnect Domain Decomposition Scheme for Solving Multiscale Composite Penetrable Objects

Literals

bibo:page_range
- 107345-107352
bibo:doi
- 10.1109/access.2020.3000650
ou:bibtex
- @article{Martin_2020, doi = {10.1109/access.2020.3000650}, url = {https://doi.org/10.1109%2Faccess.2020.3000650}, year = 2020, publisher = {Institute of Electrical and Electronics Engineers ({IEEE})}, volume = {8}, pages = {107345--107352}, author = {Victor F. Martin and David Larios and Diego M. Solis and Jose M. Taboada and Luis Landesa and Fernando Obelleiro}, title = {Tear-and-Interconnect Domain Decomposition Scheme for Solving Multiscale Composite Penetrable Objects}, journal = {{IEEE} Access}}
dcterms:creator
- Martin V.F.
dcterms:contributor
- Martin V.F.; Larios D.; Solis D.M.; Taboada J.M.; Landesa L.; Obelleiro F.
ou:eid
- 2-s2.0-85086991707
dcterms:title
- Tear-and-Interconnect Domain Decomposition Scheme for Solving Multiscale Composite Penetrable Objects
bibo:eissn
- 2169-3536
fabio:hasPublicationYear
- 2020
ou:tipoPublicacion
- Article
dcterms:publisher
- IEEE Access
vivo:identifier
- 2020-1482
vcard:url
- https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85086991707&origin=inward
ou:urlOrcid
- http://dx.doi.org/10.1109/access.2020.3000650
ou:urlScopus
- https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85086991707&origin=inward
bibo:volume
- 8