PUBLICACIÓN

Tear-and-Interconnect Domain Decomposition Scheme for Solving Multiscale Composite Penetrable Objects

Logo Open Access

ACCEDER A LA PUBLICACIÓN: Scopus Orcid

Victor F. Martin, David Larios, Diego M. Solis, Jose Manuel Taboada Varela, Luis Landesa, Fernando Obelleiro

2020 IEEE Access

Computer Science (miscellaneous) (Q1), Engineering (miscellaneous) (Q1), Materials Science (miscellaneous) (Q2)

JCR: 3.367

SJR: 0.587


CITAS

9

DOI

10.1109/access.2020.3000650

EID

2-s2.0-85086991707

EISSN

2169-3536

BIBTEX

@article{Martin_2020, doi = {10.1109/access.2020.3000650}, url = {https://doi.org/10.1109%2Faccess.2020.3000650}, year = 2020, publisher = {Institute of Electrical and Electronics Engineers ({IEEE})}, volume = {8}, pages = {107345--107352}, author = {Victor F. Martin and David Larios and Diego M. Solis and Jose M. Taboada and Luis Landesa and Fernando Obelleiro}, title = {Tear-and-Interconnect Domain Decomposition Scheme for Solving Multiscale Composite Penetrable Objects}, journal = {{IEEE} Access}}


AUTORES DE LA UEX