PUBLICACIÓN
Tear-and-Interconnect Domain Decomposition Scheme for Solving Multiscale Composite Penetrable Objects
ACCEDER A LA PUBLICACIÓN:
Martin V.F., Larios D., Solis D.M., Taboada J.M., Landesa L., Obelleiro F.
2020 IEEE Access
Computer Science (miscellaneous) (Q1), Engineering (miscellaneous) (Q1), Materials Science (miscellaneous) (Q2)
JCR: 3.367
SJR: 0.587
CITAS
8
DOI
10.1109/access.2020.3000650
EID
2-s2.0-85086991707
EISSN
2169-3536
BIBTEX
@article{Martin_2020, doi = {10.1109/access.2020.3000650}, url = {https://doi.org/10.1109%2Faccess.2020.3000650}, year = 2020, publisher = {Institute of Electrical and Electronics Engineers ({IEEE})}, volume = {8}, pages = {107345--107352}, author = {Victor F. Martin and David Larios and Diego M. Solis and Jose M. Taboada and Luis Landesa and Fernando Obelleiro}, title = {Tear-and-Interconnect Domain Decomposition Scheme for Solving Multiscale Composite Penetrable Objects}, journal = {{IEEE} Access}}
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